Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.
Application:
Stannol 500-3431BF has been developed for the application with spray fluxers, but foam fluxers can also be used. The
preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.
This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.
