The halogen-free activated No-Clean flux 500-6B is suitable for both lead-free and lead-containing alloys and, due to its special resin composition, is immediately grip-resistant after cooling.
Application:
In principle, all application methods are feasible, although when foaming is employed some modification of the fluxer may
be needed. The preheating should be set in such a way that the temperature on the top side of the printed circuit board
reaches 90°-110°C. The solder temperature should be between 245°-260°C.
