| Brand : | STANNOL |
|---|---|
| Code number : | 850 50092 |
| Supplier : | 164153 |
| Flux name : | 500-3431BF |
| DIN EN 29454-1 : | 2.2.3.A |
| Solid content (%) : | 4,4 |
| No-Clean : |  |
| Volume (L) : | 2,5 |
Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.
Application:
Stannol 500-3431BF has been developed for the application with spray fluxers, but foam fluxers can also be used. The
preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.
This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.
Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.
Application:
Stannol 500-3431BF has been developed for the application with spray fluxers, but foam fluxers can also be used. The
preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.
This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.
