Heat dissipation

TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

Heat Transfer Compound without silicone.

Heat transfer compound.

Heat transfer compound

Makes application of TCER and TCOR easy.