Heat transfer compound.

HTCA is an innovative new way of applying the standard HTC.

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity.

Heat Transfer Compound without silicone.

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

Heat transfer compound

Two part epoxy bonding system with thermal conductivity of 1.1 W/m.K.

TCER has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

Makes application of TCER and TCOR easy.