Stannol 400-25 has been specially formulated for applications in the electronic industry for surfaces which are difficult to solder. An excellent wetting efficiency when soldering printed circuits, especially in foam fluxers, is achieved by the use of a stabiliser. The flux has good wetting properties and guarantees complete flux coverage during the soldering process due to the high rosin contents. The flux residues remaining after the soldering process are dry, plastic and transparent.
Application:
Stannol 400-25 can be applied with foam fluxers, but also by dipping, spraying and brushing. The preheating temperature on the PCB top surface can be set between 80° C and 120° C. During the soldering process a considerable part of the flux is rinsed off the PCB. If cleaning is required, flux residues can be removed completely with a commercial cleaner. All known cleaning processes, such as by brushing, ultrasonic, steam etc. are appropriate.
