The halogen-free activated No-Clean flux EF350 guarantees outstanding wetting capability on different surfaces (e.g. OSP, Ni/Au, HAL, chemical Sn and chemical Ag) both with lead-free and lead-containing solder alloys.
Application:
The Stannol EasyFlux 350 has been developed for application with spray fluxers. The preheat temperature should be at least
90° C measured on the surface of the circuit board when entering the solder wave. This temperature ensures the
evaporation of the solvent and a sufficient activation of the flux. Preheat temperatures up to 120-130°C for a short period of
time may be tolerated by the flux.