Monday 27 May 2024
Solid Content: 60%
Ideal for repairs and subsequent mounting of SMD components on tightly assembled boards and ceramic substrates.
filled with flux BM-5000 RMA, No clean.
Flux liquide.
Ready to use thickened rosin (colophony) flux with solid content in paste form for soldering copper, brass and tinned surfaces.
Halogen-free No-Clean Flux EF250 with low activation level.
VOC-free and no-clean.
Flux pen.
For soft soldering of iron, steel, copper, brass and tin.
Soldering flux made with a liquid Kolophonium Flux.
Soldering grease for tin plating of copper, brass or steel sheet.