Flux

Solid Content: 60%

Flux-Ex 500 is designed for the effective removal of all types of soldering process residues from circuit boards,

Ideal for repairs and subsequent mounting of SMD components on tightly assembled boards and ceramic substrates.

filled with flux BM-5000 RMA, No clean.

Flux liquide.

HX21 Medium is a special flux for soft soldering of metals, which cannot be soldered with usual No-Clean fluxes for the electronics manufacturing.

Suitable for repair soldering in SMT as well as for piston and bar soldering.

Specially developed for rework and repair in the electronics industry.

Ready to use thickened rosin (colophony) flux with solid content in paste form for soldering copper, brass and tinned surfaces.

Stannol 300-25 is a ready for use no clean flux for wave and drag soldering.

Stannol 400-25 has been specially formulated for applications in the electronic industry for surfaces which are difficult to solder. An excellent wetting efficiency when soldering printed circuits, especially in foam fluxers, is achieved by the use of a stabiliser. The flux has good wetting properties and guarantees complete flux coverage during the soldering process due to the high rosin contents. The flux residues remaining after the soldering process are dry, plastic and transparent.

Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.

The halogen-free activated No-Clean flux 500-6B is suitable for both lead-free and lead-containing alloys and, due to its special resin composition, is immediately grip-resistant after cooling.

Multiprint 6381 Liquid Flux is a RMA flux with a proprietary formulation that combines superior mobility and spread with faster initial wetting action.

The halogen-free No-Clean flux AK-1 has been specially developed for cable tinning, tinning on component connections, soldering on copper or copper-passivated surfaces.

Halogen-free No-Clean Flux EF250 with low activation level.

The halogen-free activated No-Clean flux EF270 with its medium activity fits well into the EF range. Specially matched solids achieve good wetting on various surfaces. EF270 can be used for lead-containing and lead-free soldering.

The halogen-free activated No-Clean flux EF350 guarantees outstanding wetting capability on different surfaces (e.g. OSP, Ni/Au, HAL, chemical Sn and chemical Ag) both with lead-free and lead-containing solder alloys.

VOC-free and no-clean.

The halogen-free activated No-Clean flux X32-10i shows a relatively wide process window. The application area of the flux is primarily in the field of solar module manufacturing. Use in consumer electronics and telecommunications is also possible.

Stannol solder flux X33-08i PV has been specially developed for use in the photovoltaic industry. The flux relies on a complex alcohol-based composition that is free of rosin and halogens and also has a low solids content. Due to its excellent wettability on solar cells, X33-08i PV is an excellent choice for companies in the photovoltaic industry looking for a high-quality and reliable soldering flux.

Flux pen.

For soft soldering of iron, steel, copper, brass and tin.

Soldering flux made with a liquid Kolophonium Flux.

Soldering grease for tin plating of copper, brass or steel sheet.

The flux Solder Fluid No. 1V containing halogens is a well activated inorganic flux. The flux is mainly used for soldering steel/iron.