| Brand : | BUNGARD |
|---|---|
| Code number : | 580 27300 |
| Supplier : | 80215 |
| Power (W) : | 3650 |
| Max. PCB substrate surface (mm) : | 300 x 370 |
| Minimum temperature (°C) : | 60 |
| Maximum temperature (°C) : | 300 |
| External sizes (mm) : | 550 x 490 x 335 |
| Weight (kg) : | 18 |
The HA06 is a solder oven for SMD component with the use of lead free paste.
The oven is work-ing with full convection forced air during the preheat stage.
When the reflow stage is entered the heating will be done by hot air and quartz lamps.
The lamps are needed to get a short ramp speed.
Once the refl ow set point is reached the lamp power will be reduced to a minimum.
At this point 85% of the heating is caused by forced hot air.
This unique feature makes the oven suitable for solder big SMD components and/or components with pads under their casing while using lead free paste.
With good maintenance and proper use the oven will serve your solder needs for a long time with high quality solder results.
Features
Technical data
The HA06 is a solder oven for SMD component with the use of lead free paste.
The oven is work-ing with full convection forced air during the preheat stage.
When the reflow stage is entered the heating will be done by hot air and quartz lamps.
The lamps are needed to get a short ramp speed.
Once the refl ow set point is reached the lamp power will be reduced to a minimum.
At this point 85% of the heating is caused by forced hot air.
This unique feature makes the oven suitable for solder big SMD components and/or components with pads under their casing while using lead free paste.
With good maintenance and proper use the oven will serve your solder needs for a long time with high quality solder results.
Features
Technical data
