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BERNSTEIN - CLAMPING LID

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For illustration purpose only

Covered with 20 mm thick ESD foam.
Components of different sizes are pressed in such a way that soldering can be carried out correctly after the circuit board holder has been turned.
Size of cover: 240 x 130 mm
Use: in conjunction with circuit board holder 9-253.

Covered with 20 mm thick ESD foam.
Components of different sizes are pressed in such a way that soldering can be carried out correctly after the circuit board holder has been turned.
Size of cover: 240 x 130 mm
Use: in conjunction with circuit board holder 9-253.