| Code number : | 751 00197 |
|---|
This device forms the leads of IC's by means of the outside laying ball bearing.
It can be used from both sides to form IC's to a grid dimension of 7,5mm and 15mm.
Rugged design made of black anodised aluminium with a 10mm stud connection for grounding the device.
This device forms the leads of IC's by means of the outside laying ball bearing.
It can be used from both sides to form IC's to a grid dimension of 7,5mm and 15mm.
Rugged design made of black anodised aluminium with a 10mm stud connection for grounding the device.
