Designed for heavy duty applications and large components : (LED Soldering, Solar Technology, Electronic components, Multi-layer boards, Large heat sinks, Hyper frequency PCB with a big dissipater)
Fast heat up time in 7 sec to 50°C at 350°C.
Thermal Core Technology for optimized heat transfer
IPC Standard - Are fully compliant with IPC industry standards.
The MS versions are also MIL-SPEC Compliant
