Leadfree solder paste, No clean.
Code number | Model | Alloy | Flux name | Flux content (%) | J-STD-004 | Weight (g) | Point de fusion (°C) | Powder size (µm) | Container | Stock | Price ( ExVAT ) |
---|---|---|---|---|---|---|---|---|---|---|---|
591 81800 020 | 10 cc | Sn96,5 Ag3 Cu0,5 | GT(R)S | 13 | ROL1 | 40 | 217 - 220 | 20 - 38 | 10cc seringe | Login required |
Activated lead-containing solder paste ROL1. Sn62Pb36Ag2
Code number | Alloy | DIN EN 29454-1 | J-STD-004 | Weight (g) | Point de fusion (°C) | Powder size (µm) | Stock | Price ( ExVAT ) |
---|---|---|---|---|---|---|---|---|
850 51001 | Sn62 Pb36 Ag2 | 1.1.2.C | ROL1 | 500 | 179 | 25 - 45 | Login required |
Lead-free, no-clean solder paste.
Code number | Alloy | DIN EN 29454-1 | J-STD-004 | Weight (g) | Point de fusion (°C) | Powder size (µm) | Stock | Price ( ExVAT ) |
---|---|---|---|---|---|---|---|---|
850 51002 | Sn95,5 Ag4 Cu0,5 | 1.2.2.C | REL1 | 500 | 217 - 223 | 25 - 45 | Login required |
Lead-free, No-clean solder paste, REL0.
Code number | Alloy | DIN EN 29454-1 | J-STD-004 | Weight (g) | Point de fusion (°C) | Powder size (µm) | Stock | Price ( ExVAT ) |
---|---|---|---|---|---|---|---|---|
850 51003 | Sn95,5 Ag4 Cu0,5 | 1.2.2.C | REL0 | 500 | 217-223 | 25 - 45 | Login required | |
850 51004 | Sn96,5 Ag3 Cu0,5 | 1.2.2.C | REL0 | 500 | 217-223 | 25 - 45 | Login required | |
850 51005 | Sn99 Ag0,3 Cu0,7 | 1.2.2.C | REL0 | 500 | 217-227 | 25 - 45 | Login required | |
850 51006 | Sn96,5 Ag3 Cu0,5 | 1.2.2.C | REL0 | 500 | 217-223 | 20 - 38 | Login required |
Lead Free No-Clean solder paste, REL0.
Code number | Alloy | J-STD-004 | Weight (g) | Point de fusion (°C) | Powder size (µm) | Stock | Price ( ExVAT ) |
---|---|---|---|---|---|---|---|
850 51007 | Sn96,5 Ag3,0 Cu0,5 | REL0 | 500 | 217 - 220 | 25 - 45 | Login required | |
850 51009 | Sn99 Ag0,3 Cu0,7 | REL0 | 500 | 217 - 227 | 25 - 45 | Login required |