STANNOL - SOLDER PASTE SP2200 TSC305-89-4 - TSC305 - Sn96,5Ag3,0Cu0,5 - size 4 - 500g jar

Lead-free, No-clean solder paste, REL0.

The solder paste Stannol SP2200 was developed especially for lead-free alloys with the TSC405 (Sn95.5Ag4Cu0.5) and TSC305 (Sn969.5Ag3Cu0.5) as a standard alloys.
It contains a highly active type L no-clean flux.
With a special formulation for perfect wetting, the SP2200 fulfils all the requirements for a modern solder paste, which can be used in a high volume electronics manufacturing.
Wetting properties have been optimized for all known surfaces in the electronics industry.
As this solder paste leaves only very small amounts of residues after soldering on the PCB, and these small amounts of residues show exceptional electrical safety, there is no need for cleaning.

Product Advantages

• Especially formulated for lead-free alloys.
• Suitable for fine pitch down to 0,4mm.
• Compatible with a wide range of solderable surfaces.
• Effective over a wide range of reflow profiles in air or nitrogen.
• Produces safe residues - eliminates the need for cleaning.
• High tackiness for high speed pick and place equipment.
• Temperature range for application 20-32°C.
• Exceptional print to print consistency.