| Brand : | STANNOL |
|---|---|
| Code number : | 850 50111 |
| Supplier : | 164103 |
| Flux name : | EF250 |
| DIN EN 29454-1 : | 2.2.3.A |
| J-STD-004 : | ORL0 |
| Application method : | Spraying |
| : | High |
| : | 2,5 |
| Volume (L) : | 2,5 |
Halogen-free No-Clean Flux EF250 with low activation level.
Developed with a low activation level and only 2.5% of solids, one of the development goals was to realize a very low level of residues on PCB and inside the soldering equipment.
Using especially matching activators this flux achieves very good wetting on various surfaces.
It can be used for soldering with lead-free and lead containing alloys.
The minor amounts of residues, which may build up inside the soldering equipment over weeks, can be removed easily.
Due to the well balanced activator system, which is used, the EF250 can also be used for most selective soldering processes and shows an excellent filling of through holes.
Product Advantages
Application
The flux EF250 was developed for application only with spray fluxing units.
With a narrow control of the spray fluxer, the amount of residues can be optimized.
The EF250 can be used on most available soldering equipment, with or without nitrogen.
Even if not required, we recommend the use of a full nitrogen purged soldering equipment, as the amount of required flux and therefore the amount of residues can be further reduced.
Due to the used activator combination, a good wetting on most surfaces in the electronics can be achieved (e.g. OSP, Ni/Au, chem. Sn, HASL).
Halogen-free No-Clean Flux EF250 with low activation level.
Developed with a low activation level and only 2.5% of solids, one of the development goals was to realize a very low level of residues on PCB and inside the soldering equipment.
Using especially matching activators this flux achieves very good wetting on various surfaces.
It can be used for soldering with lead-free and lead containing alloys.
The minor amounts of residues, which may build up inside the soldering equipment over weeks, can be removed easily.
Due to the well balanced activator system, which is used, the EF250 can also be used for most selective soldering processes and shows an excellent filling of through holes.
Product Advantages
Application
The flux EF250 was developed for application only with spray fluxing units.
With a narrow control of the spray fluxer, the amount of residues can be optimized.
The EF250 can be used on most available soldering equipment, with or without nitrogen.
Even if not required, we recommend the use of a full nitrogen purged soldering equipment, as the amount of required flux and therefore the amount of residues can be further reduced.
Due to the used activator combination, a good wetting on most surfaces in the electronics can be achieved (e.g. OSP, Ni/Au, chem. Sn, HASL).
