Surface mounted test point.
TP-107 series of surface mounted, printed circuit test points allows engineers to take advantage of the convenience of field testing.
The profile of the TP-107 readily accepts most commercially available spring clips and probes while providing a positive and secure anchor to the SMT board.
To provide resistance to mechanical stress, the TP-107 achieves high-strength bonding through a unique forming process which doubles the surface area of the test points mounting.
This is accomplished by forming the flat wire design in a spiral wrap on the mounting base, resulting in an adhesion to the solder pad which requires in excess of 18 pounds of force to dislodge the test point from its solder pad.
Specifications
- Contact material: .015" x .040" Phosphor Bronze #510 alloy, 1/2 hard
- Finish material: .0001" Matte Tine over .00001" Nickel or 0.0001" Min Silver over .00005" min copper
- Tape material:
- Width: 12mm
- Pitch: 4mm
- Pad size: .185" x .135"
- Conductive polycarbonate carrier meets ANSI/EIA-481 Standard
