Reflow ovens

Ovens for manufacturing and reworking of SMT products.

BUNGARD : Reflow oven HotAir 06 

The HA06 is a solder oven for SMD component with the use of lead free paste.

Code numberSupplier Power (W) Max. PCB substrate surface (mm) Minimum temperature (°C) Maximum temperature (°C) External sizes (mm) Weight (kg)StockPrice ( ExVAT )
580 27300 80215 3650 300 x 370 60 300 550 x 490 x 335 18

BUNGARD : Reflow oven Hot Air 3000 

The HotAir3000 is a stylish, practical reflow oven for manufacturing and reworking of SMT products.

Code numberSupplier Power (W) Max. PCB substrate surface (mm) Minimum temperature (°C) Maximum temperature (°C) External sizes (mm) Weight (kg)StockPrice ( ExVAT )
580 27310 80216 2400 350 x 300 60 300 504 x 500 x 314 28