Flux

Ready to use thickened rosin (colophony) flux with solid content in paste form for soldering copper, brass and tinned surfaces.

filled with flux BM-5000 RMA, No clean.

Solid Content: 60%

VOC-free and no-clean.

HX21 Medium is a special flux for soft soldering of metals, which cannot be soldered with usual No-Clean fluxes for the electronics manufacturing.

Halogen-free No-Clean Flux EF250 with low activation level.

Flux pen.

Specially developed for rework and repair in the electronics industry.

Suitable for repair soldering in SMT as well as for piston and bar soldering.

Flux-Ex 500 is designed for the effective removal of all types of soldering process residues from circuit boards,

Stannol 300-25 is a ready for use no clean flux for wave and drag soldering.

The halogen-free activated No-Clean flux 500-6B is suitable for both lead-free and lead-containing alloys and, due to its special resin composition, is immediately grip-resistant after cooling.

The halogen-free No-Clean flux AK-1 has been specially developed for cable tinning, tinning on component connections, soldering on copper or copper-passivated surfaces.

The halogen-free activated No-Clean flux X32-10i shows a relatively wide process window. The application area of the flux is primarily in the field of solar module manufacturing. Use in consumer electronics and telecommunications is also possible.

The halogen-free activated No-Clean flux EF350 guarantees outstanding wetting capability on different surfaces (e.g. OSP, Ni/Au, HAL, chemical Sn and chemical Ag) both with lead-free and lead-containing solder alloys.

The flux Solder Fluid No. 1V containing halogens is a well activated inorganic flux. The flux is mainly used for soldering steel/iron.

Stannol 400-25 has been specially formulated for applications in the electronic industry for surfaces which are difficult to solder. An excellent wetting efficiency when soldering printed circuits, especially in foam fluxers, is achieved by the use of a stabiliser. The flux has good wetting properties and guarantees complete flux coverage during the soldering process due to the high rosin contents. The flux residues remaining after the soldering process are dry, plastic and transparent.

Stannol 500-3431BF is based on the well established Stannol 500-3431 with an increased solid content to provide enhanced activity, which is required for lead-free soldering. The new formula of the activators guarantees an optimum wetting of the different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit boards with alternative surfaces are introduced.

The halogen-free activated No-Clean flux EF270 with its medium activity fits well into the EF range. Specially matched solids achieve good wetting on various surfaces. EF270 can be used for lead-containing and lead-free soldering.

Stannol solder flux X33-08i PV has been specially developed for use in the photovoltaic industry. The flux relies on a complex alcohol-based composition that is free of rosin and halogens and also has a low solids content. Due to its excellent wettability on solar cells, X33-08i PV is an excellent choice for companies in the photovoltaic industry looking for a high-quality and reliable soldering flux.

Ideal for repairs and subsequent mounting of SMD components on tightly assembled boards and ceramic substrates.

Soldering flux made with a liquid Kolophonium Flux.

Flux liquide.

Soldering grease for tin plating of copper, brass or steel sheet.

For soft soldering of iron, steel, copper, brass and tin.