Heat Transfer Compound without silicone

Heat transfer compound.

Non-silicone Heat Transfer Compound Aerosol

HTCA is an innovative new way of applying the standard HTC.

Non-Silicone Heat Transfer Compound Xtra

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity.

HTCX_ZF Zinc Free Non-Silicone Heat Transfer Compound

HTCP - Heat Transfer Compound Plus - Non Silicone

Heat Transfer Compound without silicone.

Non-Silicone Heat Transfer Compound PLUS Xtra

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

Heat Transfer Compound

Heat transfer compound

Silicone Heat Transfer Compound Plus

TBS - Thermal Bonding System

Two part epoxy bonding system with thermal conductivity of 1.1 W/m.K.

Thermally Conductive Ethoxy RTV

TCER has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

Thermally Conductive Oxime RTV

TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

Application Gun

Makes application of TCER and TCOR easy.