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IDEAL-TEK - DESOLDERING BRAID 3,7MM-1,5M

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Brand :	IDEAL-TEK
Code number :	819 80370
Supplier :	80-005-05
Width (mm) :	3,7
Length (m) :	1,5
Color :	Brown

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Safely removes solder in all application requiring Type ROL0 rosin flux.
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes.

Pure copper braid.
1,5m spool packaged in ESD-safe static dissipative bobbins.
Noncorrosive ultra purity Type R rosin flux (ROL0).
Minimizes the risk of heat damage to the board.
Will not leave ionic contamination on the boards.

Specifications:

MIL-F-14256 F type R flux
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
AINSI/IPC J STD-004, Type ROL0

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Pure copper braid.
1,5m spool packaged in ESD-safe static dissipative bobbins.
Noncorrosive ultra purity Type R rosin flux (ROL0).
Minimizes the risk of heat damage to the board.
Will not leave ionic contamination on the boards.

Specifications:

MIL-F-14256 F type R flux
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
AINSI/IPC J STD-004, Type ROL0