Filters

IDEAL-TEK - DESOLDERING BRAID - ROSIN - ESD - 0,8mm - 1,5m x1

Click to zoom

For illustration purpose only

Brand :	IDEAL-TEK
Code number :	819 80371
Supplier :	80-005-01
Width (mm) :	0,8
Length (m) :	1,5
Color :	White

Go to product

Safely removes solder in all application requiring Type ROL0 rosin flux.
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes.

Pure copper braid.
1,5m spool packaged in ESD-safe static dissipative bobbins.
Noncorrosive ultra purity Type R rosin flux (ROL0).
Minimizes the risk of heat damage to the board.
Will not leave ionic contamination on the boards.

Specifications:

MIL-F-14256 F type R flux
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
AINSI/IPC J STD-004, Type ROL0

Stock and price : Login required

Pure copper braid.
1,5m spool packaged in ESD-safe static dissipative bobbins.
Noncorrosive ultra purity Type R rosin flux (ROL0).
Minimizes the risk of heat damage to the board.
Will not leave ionic contamination on the boards.

Specifications:

MIL-F-14256 F type R flux
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
AINSI/IPC J STD-004, Type ROL0