CIPEX 40 is a washing solution ready to use pratically foamless to clean flux residues and solder paste on printed circuit boards after reflow.
This product is used in spraying machine and ultrasonic Machine.
It can both be used for manual cleaning including cleaning of reflow oven, stream traps, etc ...

The CIPEX 50 is the concentrated version of CIPEX 40.
The recommended dilution is 20% in water déminéraisée or softened water.

USE

• Spray Machine (cleaning process recommended)
  • Cleaning 5-15 min at 30-35 ° C
  • 5 min rinse in normal water
  • Rinse 5 min from 30 to 45 ° C in deionized water
  • Drying 20 min at 70 ° C

• Machine online (cleaning process recommended)
  • Cleaning 3-5 min at 30-35 ° C
  • 5 min rinse in normal water
  • Rinse 5 min from 30 to 50 ° C in deionized water
  • Drying 10 min at 70 ° C - 90 ° C

• Ultrasound machine (cleaning process recommended)
  • Cleaning 5 min at 30-35 ° C
  • 5 min rinse in normal water
  • Rinse 5 min from 30 to 45 ° C in deionized water
  • Drying 10 min at 70 ° C

These cycles are provided for information and will be optimized according to the types of equipment and process streams.

CHARACTERISTICS

• A mixture of solvents and saponifying
• Washable with water
• Non-flammable
• Biodegradability> 90 ° C
• Good clean solder pastes and flux residues
• Excellent compatibility with metals and plastics

TECHNICAL SPECIFICATIONS

boiling point:> 100 ° C
Flash Point:> 115 ° C
Specific gravity (20 ° C): 1.01
Freezing Point:> -10 ° C
Viscosity (CIPEX 50): 15-25 cPs
Form: Liquid
Color: Yellow